- All
- Product Name
- Product Keyword
- Product Model
- Product Summary
- Product Description
- Multi Field Search
 |
| Quantity: | |
|---|---|
Model | YT-01 |
Tesnsile Strength MPa ≥ | 35.0 |
Elongation at Rupture % ≥ | 400 |
Bulk Density g/L ≥ | 350 |
Median Particle Size μm | 20 ~ 30 |
Moisture Content % ≤ | 0.04 |
Melting Point ℃ | 327±5 |
Standard Relative Density | 2.150 ~ 2.180 |
Bendability (Thickness 0.1mm film, 23℃) Million Times ≥ | 200 |
Creep Properties (23℃, 13.7MPa)% ≤ | 5 |
Processing Method | Molding |
Usage | Mainly used in diaphragm pumps, semiconductors, food machinery and high-end pumps, valve linings, etc. This product has very good mechanical and electrical properties, and a denser polymer structure, which significantly improves the deformability under load (cold flow) and improved solderability |
Packing, Storage & Transportation | 1. The product is packed in two layers of plastic bags and placed in a hard barrel, with a net weight of 20KG per barrel, and a product certificate should be attached to each barrel. 2. The product is transported as non-dangerous goods. During transportation, moisture and severe vibration should be avoided to avoid package damage. 3. The product should be stored in a clean, cool and dry warehouse to prevent dust, water vapor and other sundries from entering. |
